Cargando…

Thermal Conductivity and Microstructure of Novel Flaxseed-Gum-Filled Epoxy Resin Biocomposite: Analytical Models and X-ray Computed Tomography

The growing awareness of the environment and sustainable development has prompted the search for solutions involving the development of bio-based composite materials for insulating applications, offering an alternative to traditional synthetic materials such as glass- and carbon-reinforced composite...

Descripción completa

Detalles Bibliográficos
Autores principales: Zaidi, Mohammed, Baillis, Dominique, Naouar, Naim, Depriester, Michael, Delattre, François
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10533198/
https://www.ncbi.nlm.nih.gov/pubmed/37763595
http://dx.doi.org/10.3390/ma16186318
Descripción
Sumario:The growing awareness of the environment and sustainable development has prompted the search for solutions involving the development of bio-based composite materials for insulating applications, offering an alternative to traditional synthetic materials such as glass- and carbon-reinforced composites. In this study, we investigate the thermal and microstructural properties of new biocomposite insulating materials derived from flaxseed-gum-filled epoxy, with and without the inclusion of reinforced flax fibers. A theoretical approach is proposed to estimate the thermal conductivity, while the composite’s microstructure is characterized using X-ray Computed Tomography and image analysis. The local thermal conductivity of the flax fibers and the flaxseed gum matrix is identified by using effective thermal conductivity measurements and analytical models. This study provides valuable insight into the thermal behavior of these biocomposites with varying compositions of flaxseed gum and epoxy resin. The results obtained could not only contribute to a better understanding the thermal properties of these materials but are also of significant interest for advanced numerical modeling applications.