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Organosilicon Compounds in Hot-Melt Adhesive Technologies

Hot-melt adhesives (HMAs) are thermoplastic materials that can bond various substrates by solidifying rapidly upon cooling from the molten state, and their modification with organosilicon compounds can result in crosslinking behavior, characteristic of gels. Organosilicon compounds are hybrid molecu...

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Detalles Bibliográficos
Autores principales: Czakaj, Jakub, Sztorch, Bogna, Romanczuk-Ruszuk, Eliza, Brząkalski, Dariusz, Przekop, Robert E.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10534555/
https://www.ncbi.nlm.nih.gov/pubmed/37765562
http://dx.doi.org/10.3390/polym15183708

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