A Comparative Study of the Repair Bond Strength of New Self-Adhesive Restorative Materials With a Resin Composite Material

Aim: The aim of the present study is to compare the repair bond strengths (RBSs) of Cention-N (light-cure and self-cure modes), Equia Forte HT Fil and a nanohybrid resin composite. Materials and methods: Equia Forte HT Fil (GC, Tokyo, Japan), Cention-N (Ivoclar Vivadent, Schaan, Liechtenstein) and Filtek Z550 (3M ESPE, St Paul, MN, USA) were used in this study. Equia Forte HT Fil (EQF), Cention-N self-cure (CSC), Cention-N light-cure (CLC) and Filtek Z550 (Z550) groups were formed. A total of 40 samples were prepared; 10 samples in each group (n = 10). After the polymerization was completed according to the manufacturer's instructions, the samples were polished with OptiDisc (Kerr Corporation, Orange, USA) for 5 s each, from extra-course to extra-fine. After all samples were stored in 37°C water for 24 h, 10,000 cycles of brushing simulator and thermal cycles were applied to the samples. The samples were prepared in accordance with the selected repair protocol, and microshear bond strength (µSBS) test was performed. Fracture analysis on debonded surfaces was visualized by scanning electron microscopy. The conformity of the data to normal distribution was analyzed by the Shapiro-Wilk test. Multiple comparisons were performed using Dunn's test. Results: Z550 showed significantly higher µSBS as compared to the other three groups. There is no difference between CSC, CLC and EQF. Conclusion: The use of Cention-N's self-cure or light-cure mode did not affect the RBS values. The RBS values of Cention-N and Equia Forte HT Fil materials are lower than those of the composite resin material.