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Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods

There is an increasing demand for the use of automotive sensors where complex working environments may easily lead to failure. Wire pull and shear test models based on finite-element analysis are established to evaluate their reliability by investigating the failure mode and mechanism of gold wire b...

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Autores principales: Sun, Yameng, Ma, Kun, Song, Yifan, Zi, Tongtong, Liu, Xun, Feng, Zheng, Zhou, Yang, Liu, Sheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10535198/
https://www.ncbi.nlm.nih.gov/pubmed/37763858
http://dx.doi.org/10.3390/mi14091695
_version_ 1785112573679501312
author Sun, Yameng
Ma, Kun
Song, Yifan
Zi, Tongtong
Liu, Xun
Feng, Zheng
Zhou, Yang
Liu, Sheng
author_facet Sun, Yameng
Ma, Kun
Song, Yifan
Zi, Tongtong
Liu, Xun
Feng, Zheng
Zhou, Yang
Liu, Sheng
author_sort Sun, Yameng
collection PubMed
description There is an increasing demand for the use of automotive sensors where complex working environments may easily lead to failure. Wire pull and shear test models based on finite-element analysis are established to evaluate their reliability by investigating the failure mode and mechanism of gold wire bonding. The effect of shear force position and pull force position on failure is also analyzed. The bonding failure was verified by experiments, which is consistent with the simulation result. The results show that: (1) The three-dimensional quantitative modeling reveals the process of bonding delamination and stress concentration. (2) The bonding–slip method (BSM) is adopted in the gold ball detaching process. The concept of three states, including deformation accumulation, cracking, and disengagement, was put forward to reveal the interface stress evolution trend according to the shear testing results. The results indicate that in the interface, the stress in the deformation accumulation state decreases from the tensile side (or compression side) to the center, and the stress in the cracking and disengagement states reduces gradually from the tensile side to the edge. When the interface is completely separated, the failed shear force concentrates on 42 g. The concept and theory proposed in this work can effectively reveal the failure mechanism of bonding interface and help to establish a new failure criterion.
format Online
Article
Text
id pubmed-10535198
institution National Center for Biotechnology Information
language English
publishDate 2023
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-105351982023-09-29 Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods Sun, Yameng Ma, Kun Song, Yifan Zi, Tongtong Liu, Xun Feng, Zheng Zhou, Yang Liu, Sheng Micromachines (Basel) Article There is an increasing demand for the use of automotive sensors where complex working environments may easily lead to failure. Wire pull and shear test models based on finite-element analysis are established to evaluate their reliability by investigating the failure mode and mechanism of gold wire bonding. The effect of shear force position and pull force position on failure is also analyzed. The bonding failure was verified by experiments, which is consistent with the simulation result. The results show that: (1) The three-dimensional quantitative modeling reveals the process of bonding delamination and stress concentration. (2) The bonding–slip method (BSM) is adopted in the gold ball detaching process. The concept of three states, including deformation accumulation, cracking, and disengagement, was put forward to reveal the interface stress evolution trend according to the shear testing results. The results indicate that in the interface, the stress in the deformation accumulation state decreases from the tensile side (or compression side) to the center, and the stress in the cracking and disengagement states reduces gradually from the tensile side to the edge. When the interface is completely separated, the failed shear force concentrates on 42 g. The concept and theory proposed in this work can effectively reveal the failure mechanism of bonding interface and help to establish a new failure criterion. MDPI 2023-08-30 /pmc/articles/PMC10535198/ /pubmed/37763858 http://dx.doi.org/10.3390/mi14091695 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Sun, Yameng
Ma, Kun
Song, Yifan
Zi, Tongtong
Liu, Xun
Feng, Zheng
Zhou, Yang
Liu, Sheng
Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods
title Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods
title_full Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods
title_fullStr Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods
title_full_unstemmed Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods
title_short Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods
title_sort failure analysis for gold wire bonding of sensor packaging based on experimental and numerical methods
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10535198/
https://www.ncbi.nlm.nih.gov/pubmed/37763858
http://dx.doi.org/10.3390/mi14091695
work_keys_str_mv AT sunyameng failureanalysisforgoldwirebondingofsensorpackagingbasedonexperimentalandnumericalmethods
AT makun failureanalysisforgoldwirebondingofsensorpackagingbasedonexperimentalandnumericalmethods
AT songyifan failureanalysisforgoldwirebondingofsensorpackagingbasedonexperimentalandnumericalmethods
AT zitongtong failureanalysisforgoldwirebondingofsensorpackagingbasedonexperimentalandnumericalmethods
AT liuxun failureanalysisforgoldwirebondingofsensorpackagingbasedonexperimentalandnumericalmethods
AT fengzheng failureanalysisforgoldwirebondingofsensorpackagingbasedonexperimentalandnumericalmethods
AT zhouyang failureanalysisforgoldwirebondingofsensorpackagingbasedonexperimentalandnumericalmethods
AT liusheng failureanalysisforgoldwirebondingofsensorpackagingbasedonexperimentalandnumericalmethods