Cargando…
Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics
For the slicing of superhard silicon nitride ceramics, diamond wire sawing technology has great potential for application, and its slicing surface characteristics are an important indicator of cutting quality. In this paper, the sawing experiments of silicon nitride ceramics were carried out within...
Autores principales: | Zhang, Siyuan, Gao, Yufei, Zhang, Xingchun, Guo, Yufeng |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10535751/ https://www.ncbi.nlm.nih.gov/pubmed/37763823 http://dx.doi.org/10.3390/mi14091660 |
Ejemplares similares
-
The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw
por: Liu, Tengyun, et al.
Publicado: (2021) -
Grain flash temperatures in diamond wire sawing of silicon
por: Pala, Uygar, et al.
Publicado: (2021) -
Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon
por: Li, Ansheng, et al.
Publicado: (2023) -
Breakage Ratio of Silicon Wafer during Fixed Diamond Wire Sawing
por: Liu, Tengyun, et al.
Publicado: (2022) -
Experimental investigation of the machining characteristics in diamond wire sawing of unidirectional CFRP
por: Seeholzer, Lukas, et al.
Publicado: (2021)