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Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing
As feature sizes decrease, an investigation of pad unevenness caused by pad conditioning and its influence on chemical mechanical polishing is necessary. We set up a kinematic model to predict the pad wear profile caused by only diamond disk conditioning and verify it. This model shows the influence...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10536193/ https://www.ncbi.nlm.nih.gov/pubmed/37763846 http://dx.doi.org/10.3390/mi14091683 |