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Four-Dimensionally Printed Continuous Carbon Fiber-Reinforced Shape Memory Polymer Composites with Diverse Deformation Based on an Inhomogeneous Temperature Field

Four-dimensionally printed continuous carbon fiber-reinforced shape memory polymer composite (CFSMPC) is a smart material with the ability to bear loads and undergo deformation. The deformation of CFSMPC can be driven by the electrothermal effect of carbon fibers. In this study, the effect of temper...

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Detalles Bibliográficos
Autores principales: Wang, Hongyan, Zhang, Zhongsen, Fu, Kunkun, Li, Yan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10537134/
https://www.ncbi.nlm.nih.gov/pubmed/37765594
http://dx.doi.org/10.3390/polym15183740
Descripción
Sumario:Four-dimensionally printed continuous carbon fiber-reinforced shape memory polymer composite (CFSMPC) is a smart material with the ability to bear loads and undergo deformation. The deformation of CFSMPC can be driven by the electrothermal effect of carbon fibers. In this study, the effect of temperature on the shape memory recovery performance of polylactic acid (PLA) was first studied experimentally. Continuous carbon fibers were incorporated into PLA to design CFSMPCs with thickness gradients and hand-shaped structures, respectively. The distribution strategy of the carbon fibers was determined based on simulations of the electrically driven shape recovery process of the aforementioned structures. Both the simulations and experiments demonstrated that the electrification of the CFSMPC structures resulted in an inhomogeneous temperature field, leading to distinct deformation recovery processes. Eventually, a precise unfolding was achieved for the thickness gradient structure and the five fingers in the hand-shaped structure by utilizing a safe voltage of 6 V. This demonstrates that the 4D-printed CFSMPC with diverse deformations based on an inhomogeneous temperature field has potential applications in actuators, reconfigurable devices, and other fields.