Stabilizing Non‐Fullerene Organic Photodiodes through Interface Engineering Enabled by a Tin Ion‐Chelated Polymer

The recent emergence of non‐fullerene acceptors (NFAs) has energized the field of organic photodiodes (OPDs) and made major breakthroughs in their critical photoelectric characteristics. Yet, stabilizing inverted NF‐OPDs remains challenging because of the intrinsic degradation induced by improper interfaces. Herein, a tin ion‐chelated polyethyleneimine ethoxylated (denoted as PEIE‐Sn) is proposed as a generic cathode interfacial layer (CIL) of NF‐OPDs. The chelation between tin ions and nitrogen/oxygen atoms in PEIE‐Sn contributes to the interface compatibility with efficient NFAs. The PEIE‐Sn can effectively endow the devices with optimized cascade alignment and reduced interface defects. Consequently, the PEIE‐Sn‐OPD exhibits properties of anti‐environmental interference, suppressed dark current, and accelerated interfacial electron extraction and transmission. As a result, the unencapsulated PEIE‐Sn‐OPD delivers high specific detection and fast response speed and shows only slight attenuation in photoelectric performance after exposure to air, light, and heat. Its superior performance outperforms the incumbent typical counterparts (ZnO, SnO(2), and PEIE as the CILs) from metrics of both stability and photoelectric characteristics. This finding suggests a promising strategy for stabilizing NF‐OPDs by designing appropriate interface layers.