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Rapid Fabrication of Flexible Cu@Ag Flake/SAE Composites with Exceptional EMIS and Joule Heating Performance

[Image: see text] High electromagnetic interference shielding (EMIS) effectiveness and good thermal management properties are both required to meet the rapid development of integrated electronic components. However, it remains challenging to obtain environmentally friendly and flexible films with hi...

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Detalles Bibliográficos
Autores principales: Huang, Zhongxin, Zhang, Yong, Wang, Huipeng, Li, Yuanyuan, Cui, Jiewu, Wang, Yan, Liu, Jiaqin, Wu, Yucheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2023
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10568693/
https://www.ncbi.nlm.nih.gov/pubmed/37841125
http://dx.doi.org/10.1021/acsomega.3c04404
Descripción
Sumario:[Image: see text] High electromagnetic interference shielding (EMIS) effectiveness and good thermal management properties are both required to meet the rapid development of integrated electronic components. However, it remains challenging to obtain environmentally friendly and flexible films with high EMIS and thermal management performance in an efficient and scalable way. In this paper, an environmentally friendly strategy is proposed to synthesize multifunctional waterborne Cu@Ag flake conductive films using water as the solvent and silicone–acrylic emulsion (SAE) as a matrix. The obtained films show high electrical conductivity and exceptional EMI SE and electrothermal conversion properties. The EMI SE in the X-band is higher than 76.31 dB at a thickness of 60 μm owing to the ultrahigh electrical conductivity of 1073.61 S cm(–1). The film warms up quickly to 102.1 °C within 10 s under a low voltage of 2.0 V. In addition, the shielding coating is sufficiently flexible to retain a conductivity of 93.4% after 2000 bending–release cycles with a bending radius of 3 mm. This work presents an alternative strategy to produce high EMIS effectiveness and Joule heating films for highly integrated and flexible electronic components in a green, scalable, and highly efficient way.