Development of a Simple Electroless Method for Depositing Metallic Pt-Pd Nanoparticles over Wire Gauge Support for Removal of Hydrogen in a Nuclear Reactor

Electroless noble metal deposition on the conducting substrate is widely used to obtain the desired film or coating on the substrate of interest. Wire-gauge-based Pt/Pd/Pt-Pd (individually, sequentially, and simultaneously deposited) catalysts have been developed using formaldehyde and sodium formate as reducing agents. Various surface pretreatment methods like SnCl(2) + PdCl(2) seeding, oxalic acid etching, and HCl activation (etching) have been employed to obtain the desired noble metal coating. Minimum time duration was observed for simultaneously deposited catalysts using formaldehyde as a reducing agent. Prepared catalysts were characterized for noble metal deposition, coating kinetics, surface morphology, and binding energy. The catalyst was found to be active for H(2) and O(2) recombination reactions for hydrogen mitigation applications in nuclear reactors.