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Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES)
Modern printed electronics applications require patterning of fine conductive lines of sufficient thickness. However, the two requirements for pattern width and thickness are a trade-off. To print fine pattern at a micrometer size, the nozzle diameter must be approximately the size of the pattern wi...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10582013/ https://www.ncbi.nlm.nih.gov/pubmed/37848513 http://dx.doi.org/10.1038/s41598-023-45083-6 |
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author | Rahman, Md. Khalilur Lee, Jin-Sol Kwon, Kye-Si |
author_facet | Rahman, Md. Khalilur Lee, Jin-Sol Kwon, Kye-Si |
author_sort | Rahman, Md. Khalilur |
collection | PubMed |
description | Modern printed electronics applications require patterning of fine conductive lines of sufficient thickness. However, the two requirements for pattern width and thickness are a trade-off. To print fine pattern at a micrometer size, the nozzle diameter must be approximately the size of the pattern width, so only low-viscosity inks are used. As a result, the pattern is likely to be very thin and multiple overlapping printing is required for sufficient conductance. In order to use high viscosity ink for fine patterning, near field electrospinning (NFES) is attracting attention because it can print very thin and thick patterns using large nozzles (high-viscosity ink). Until now, silver paste ink has been used for microconductive patterning using electrospinning. However, Ag nanoparticle (NP) inks are expensive. In this study, we report the use of a relatively inexpensive CuO NP ink for electrospinning-based printing. For implementation, the material preparation, printing and post-processing process are discussed. For post-processing, a continuous wave (CW) green laser with a 532 nm wavelength was used to reduce the CuO to Cu and sinter the nanoparticles. After sintering, the 50 μm width and 1.48 μm thick Cu conductive line exhibited a resistivity of 5.46 μΩ·cm, which is 3.25 times of the bulk resistivity of Cu. |
format | Online Article Text |
id | pubmed-10582013 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2023 |
publisher | Nature Publishing Group UK |
record_format | MEDLINE/PubMed |
spelling | pubmed-105820132023-10-19 Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES) Rahman, Md. Khalilur Lee, Jin-Sol Kwon, Kye-Si Sci Rep Article Modern printed electronics applications require patterning of fine conductive lines of sufficient thickness. However, the two requirements for pattern width and thickness are a trade-off. To print fine pattern at a micrometer size, the nozzle diameter must be approximately the size of the pattern width, so only low-viscosity inks are used. As a result, the pattern is likely to be very thin and multiple overlapping printing is required for sufficient conductance. In order to use high viscosity ink for fine patterning, near field electrospinning (NFES) is attracting attention because it can print very thin and thick patterns using large nozzles (high-viscosity ink). Until now, silver paste ink has been used for microconductive patterning using electrospinning. However, Ag nanoparticle (NP) inks are expensive. In this study, we report the use of a relatively inexpensive CuO NP ink for electrospinning-based printing. For implementation, the material preparation, printing and post-processing process are discussed. For post-processing, a continuous wave (CW) green laser with a 532 nm wavelength was used to reduce the CuO to Cu and sinter the nanoparticles. After sintering, the 50 μm width and 1.48 μm thick Cu conductive line exhibited a resistivity of 5.46 μΩ·cm, which is 3.25 times of the bulk resistivity of Cu. Nature Publishing Group UK 2023-10-17 /pmc/articles/PMC10582013/ /pubmed/37848513 http://dx.doi.org/10.1038/s41598-023-45083-6 Text en © The Author(s) 2023 https://creativecommons.org/licenses/by/4.0/Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/ (https://creativecommons.org/licenses/by/4.0/) . |
spellingShingle | Article Rahman, Md. Khalilur Lee, Jin-Sol Kwon, Kye-Si Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES) |
title | Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES) |
title_full | Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES) |
title_fullStr | Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES) |
title_full_unstemmed | Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES) |
title_short | Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES) |
title_sort | fine conductive line printing of high viscosity cuo ink using near field electrospinning (nfes) |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10582013/ https://www.ncbi.nlm.nih.gov/pubmed/37848513 http://dx.doi.org/10.1038/s41598-023-45083-6 |
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