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Experimental study on the thermal performance of ultra-thin flat heat pipes with novel multiscale striped composite wick structures

The rapid development of power-intensive and flexible electronic devices requires thinner heat-dissipation devices with better thermal performance. Ultra-thin flat heat pipe (UTFHP) with striped wick structure is a promising candidate for this application, but its wick structure and thermal performa...

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Detalles Bibliográficos
Autores principales: Wang, Menghao, Yang, Yinchuang, Sun, Yiwei, Li, Jian, Hao, Menglong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10587490/
https://www.ncbi.nlm.nih.gov/pubmed/37867792
http://dx.doi.org/10.1016/j.heliyon.2023.e20840