Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits

A microwave transmitter/receiver using the low-temperature co-fired ceramic substrate and ball grid array packaging demonstrates superior properties, including high integration, miniaturization, and high electromagnetic shielding. However, it holds limitations of inadequate hermeticity (that is, gas...

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Detalles Bibliográficos
Autores principales: Wang, Song, Hou, Tianyu, Huo, Rui, Chen, Zhengtian, Zeng, Qinghua, He, Ying, Zhao, Yan, Liu, Xiao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10608018/
https://www.ncbi.nlm.nih.gov/pubmed/37895701
http://dx.doi.org/10.3390/ma16206720

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10608018/
https://www.ncbi.nlm.nih.gov/pubmed/37895701
http://dx.doi.org/10.3390/ma16206720

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