Cargando…

Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits

A microwave transmitter/receiver using the low-temperature co-fired ceramic substrate and ball grid array packaging demonstrates superior properties, including high integration, miniaturization, and high electromagnetic shielding. However, it holds limitations of inadequate hermeticity (that is, gas...

Descripción completa

Detalles Bibliográficos
Autores principales: Wang, Song, Hou, Tianyu, Huo, Rui, Chen, Zhengtian, Zeng, Qinghua, He, Ying, Zhao, Yan, Liu, Xiao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10608018/
https://www.ncbi.nlm.nih.gov/pubmed/37895701
http://dx.doi.org/10.3390/ma16206720

Ejemplares similares