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Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes

MEMS gyroscopes are widely applied in consumer electronics, aerospace, missile guidance, and other fields. Reliable packaging is the foundation for ensuring the survivability and performance of the sensor in harsh environments, but gas leakage models of wafer-level MEMS gyroscopes are rarely reporte...

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Detalles Bibliográficos
Autores principales:	Xu, Yingyu, Liu, Shuibin, He, Chunhua, Wu, Heng, Cheng, Lianglun, Huang, Qinwen, Yan, Guizhen
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10609041/ https://www.ncbi.nlm.nih.gov/pubmed/37893393 http://dx.doi.org/10.3390/mi14101956

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