Degradable Plasma-Polymerized Poly(Ethylene Glycol)-Like Coating as a Matrix for Food-Packaging Applications

Currently, there is considerable interest in seeking an environmentally friendly technique that is neither thermally nor organic solvent-dependent for producing advanced polymer films for food-packaging applications. Among different approaches, plasma polymerization is a promising method that can deposit biodegradable coatings on top of polymer films. In this study, an atmospheric-pressure aerosol-assisted plasma deposition method was employed to develop a poly(ethylene glycol) (PEG)-like coating, which can act as a potential matrix for antimicrobial agents, by envisioning controlled-release food-packaging applications. Different plasma operating parameters, including the input power, monomer flow rate, and gap between the edge of the plasma head and substrate, were optimized to produce a PEG-like coating with a desirable water stability level and that can be biodegradable. The findings revealed that increased distance between the plasma head and substrate intensified gas-phase nucleation and diluted the active plasma species, which in turn led to the formation of a non-conformal rough coating. Conversely, at short plasma–substrate distances, smooth conformal coatings were obtained. Furthermore, at low input powers (<250 W), the chemical structure of the precursor was mostly preserved with a high retention of C-O functional groups due to limited monomer fragmentation. At the same time, these coatings exhibit low stability in water, which could be attributed to their low cross-linking degree. Increasing the power to 350 W resulted in the loss of the PEG-like chemical structure, which is due to the enhanced monomer fragmentation at high power. Nevertheless, owing to the enhanced cross-linking degree, these coatings were more stable in water. Finally, it could be concluded that a moderate input power (250–300 W) should be applied to obtain an acceptable tradeoff between the coating stability and PEG resemblance.