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Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints

With the rapid iteration of microsystem integrated technology, the miniaturization of electronic devices requires packaging materials with higher reliability. In this work, the microstructure evolution and mechanical properties of novel epoxy composite SAC305 solder joints were studied after isother...

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Detalles Bibliográficos
Autores principales:	Zhang, Peng, Xue, Songbai, Liu, Lu, Wang, Jianhao, Tatsumi, Hiroaki, Nishikawa, Hiroshi
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2023
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10610818/ https://www.ncbi.nlm.nih.gov/pubmed/37896411 http://dx.doi.org/10.3390/polym15204168

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