Suppression of the redox reaction between the IGZO surface and the reducing agent TMA using fluorine oxidizing agent treatment

We propose that the post-deposition oxidation of the IGZO surface is essential for improving the interface quality, with Al(2)O(3) prepared by atomic layer deposition (ALD) employing a common metal precursor trimethylaluminum (TMA). Here, the ALD-Al(2)O(3) process was conducted using H(2)O as an oxidant at a substrate temperature of 150 °C after IGZO deposition. The depth-resolved X-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM) data reveal the defect-rich and poor interface of the standard Al(2)O(3)/IGZO stack due to the redox reaction between the IGZO surface and TMA. The anion character of the IGZO was modified by introducing fluorine, which is known as a stability enhancer for oxide semiconductors. We highlight that the presence of the fluorine also improves the interface quality with ALD-Al(2)O(3). As a consequence of the fluorine incorporation prior to the ALD-Al(2)O(3) process, the chemical reduction reaction of the IGZO surface was effectively alleviated, resulting in a defect-passivated and sharp interface owing to the strong oxidizing nature of the fluorine.