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Mechanical Performance of Adhesive Connections in Structural Applications

Adhesive bonding is an excellent candidate for realising connections for secondary structures in structural applications such as offshore wind turbines and installations, avoiding the risk and associated welding problems. The strength of the adhesive layer is an important parameter to consider in th...

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Detalles Bibliográficos
Autores principales: Lamberti, Marco, Maurel-Pantel, Aurélien, Lebon, Frédéric
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10671932/
https://www.ncbi.nlm.nih.gov/pubmed/38004996
http://dx.doi.org/10.3390/ma16227066
Descripción
Sumario:Adhesive bonding is an excellent candidate for realising connections for secondary structures in structural applications such as offshore wind turbines and installations, avoiding the risk and associated welding problems. The strength of the adhesive layer is an important parameter to consider in the design process it being lower than the strength capacity of the bonding material. The presence of defects in the adhesive materials undoubtedly influences the mechanical behaviour of bonded composite structures. More specifically, the reduction in strength is more pronounced as the presence of defects (voids) increases. For this reason, a correct evaluation of the presence of defects, which can be translated into damage parameters, has become essential in predicting the actual behaviour of the bonded joints under different external loading conditions. In this paper, an extensive experimental programme has been carried out on adhesively bonded connections subjected to Mode I and Mode II loading conditions in order to characterise the mechanical properties of a commercial epoxy resin and to define the damage parameters. The initial damage parameters of the adhesive layer have been identified according to the Kachanov–Sevostianov material definition, which is able to take into account the presence of diffuse initial cracking.