Cargando…
Bond Wire Fatigue of Au, Cu, and PCC in Power LED Packages †
Bond wire failure, primarily wire neck breakage, in power LED devices due to thermomechanical fatigue is one of the main reliability issues in power LED devices. Currently, the standard testing methods to evaluate the device’s lifetime involve time-consuming thermal cycling or thermal shock tests. W...
Autores principales: | Czerny, Bernhard, Schuh, Sebastian |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10672991/ https://www.ncbi.nlm.nih.gov/pubmed/38004859 http://dx.doi.org/10.3390/mi14112002 |
Ejemplares similares
-
Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
por: Chong Leong, Gan, et al.
Publicado: (2013) -
Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
por: Chong Leong, Gan, et al.
Publicado: (2014) -
Hermetic Packaging Based on Cu–Sn and Au–Au Dual Bonding for High-Temperature Graphene Pressure Sensor
por: Wang, Junqiang, et al.
Publicado: (2022) -
Research Progress on Bonding Wire for Microelectronic Packaging
por: Zhou, Hongliang, et al.
Publicado: (2023) -
Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging
por: Zhang, Yuemin, et al.
Publicado: (2023)