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A Review of Silver Wire Bonding Techniques

The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, i...

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Detalles Bibliográficos
Autores principales: An, Bin, Zhou, Hongliang, Cao, Jun, Ming, Pingmei, Persic, John, Yao, Jingguang, Chang, Andong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673367/
https://www.ncbi.nlm.nih.gov/pubmed/38004986
http://dx.doi.org/10.3390/mi14112129
_version_ 1785149601456586752
author An, Bin
Zhou, Hongliang
Cao, Jun
Ming, Pingmei
Persic, John
Yao, Jingguang
Chang, Andong
author_facet An, Bin
Zhou, Hongliang
Cao, Jun
Ming, Pingmei
Persic, John
Yao, Jingguang
Chang, Andong
author_sort An, Bin
collection PubMed
description The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed.
format Online
Article
Text
id pubmed-10673367
institution National Center for Biotechnology Information
language English
publishDate 2023
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-106733672023-11-20 A Review of Silver Wire Bonding Techniques An, Bin Zhou, Hongliang Cao, Jun Ming, Pingmei Persic, John Yao, Jingguang Chang, Andong Micromachines (Basel) Review The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed. MDPI 2023-11-20 /pmc/articles/PMC10673367/ /pubmed/38004986 http://dx.doi.org/10.3390/mi14112129 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Review
An, Bin
Zhou, Hongliang
Cao, Jun
Ming, Pingmei
Persic, John
Yao, Jingguang
Chang, Andong
A Review of Silver Wire Bonding Techniques
title A Review of Silver Wire Bonding Techniques
title_full A Review of Silver Wire Bonding Techniques
title_fullStr A Review of Silver Wire Bonding Techniques
title_full_unstemmed A Review of Silver Wire Bonding Techniques
title_short A Review of Silver Wire Bonding Techniques
title_sort review of silver wire bonding techniques
topic Review
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673367/
https://www.ncbi.nlm.nih.gov/pubmed/38004986
http://dx.doi.org/10.3390/mi14112129
work_keys_str_mv AT anbin areviewofsilverwirebondingtechniques
AT zhouhongliang areviewofsilverwirebondingtechniques
AT caojun areviewofsilverwirebondingtechniques
AT mingpingmei areviewofsilverwirebondingtechniques
AT persicjohn areviewofsilverwirebondingtechniques
AT yaojingguang areviewofsilverwirebondingtechniques
AT changandong areviewofsilverwirebondingtechniques
AT anbin reviewofsilverwirebondingtechniques
AT zhouhongliang reviewofsilverwirebondingtechniques
AT caojun reviewofsilverwirebondingtechniques
AT mingpingmei reviewofsilverwirebondingtechniques
AT persicjohn reviewofsilverwirebondingtechniques
AT yaojingguang reviewofsilverwirebondingtechniques
AT changandong reviewofsilverwirebondingtechniques