Cargando…
A Review of Silver Wire Bonding Techniques
The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, i...
Autores principales: | , , , , , , |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673367/ https://www.ncbi.nlm.nih.gov/pubmed/38004986 http://dx.doi.org/10.3390/mi14112129 |
_version_ | 1785149601456586752 |
---|---|
author | An, Bin Zhou, Hongliang Cao, Jun Ming, Pingmei Persic, John Yao, Jingguang Chang, Andong |
author_facet | An, Bin Zhou, Hongliang Cao, Jun Ming, Pingmei Persic, John Yao, Jingguang Chang, Andong |
author_sort | An, Bin |
collection | PubMed |
description | The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed. |
format | Online Article Text |
id | pubmed-10673367 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2023 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-106733672023-11-20 A Review of Silver Wire Bonding Techniques An, Bin Zhou, Hongliang Cao, Jun Ming, Pingmei Persic, John Yao, Jingguang Chang, Andong Micromachines (Basel) Review The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bonding wire currently being studied by researchers, including pure silver wire, alloy silver wire, and coated silver wire, and describes their respective characteristics and development statuses. Secondly, the development of silver-based bonding wire in manufacturing and bonding processes is analyzed, including common silver wire manufacturing processes and their impact on silver wire performance, as well as the impact of bonding parameters on silver wire bonding quality and reliability. Subsequently, the reliability of silver wire bonding is discussed, with a focus on analyzing the effects of corrosion, electromigration, and intermetallic compounds on bonding reliability, including the causes and forms of chlorination and sulfurization, the mechanism and path of electromigration, the formation and evolution of intermetallic compounds, and evaluating their impact on bonding strength and reliability. Finally, the development status of silver wire bonding technology is summarized and future research directions for silver wire are proposed. MDPI 2023-11-20 /pmc/articles/PMC10673367/ /pubmed/38004986 http://dx.doi.org/10.3390/mi14112129 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Review An, Bin Zhou, Hongliang Cao, Jun Ming, Pingmei Persic, John Yao, Jingguang Chang, Andong A Review of Silver Wire Bonding Techniques |
title | A Review of Silver Wire Bonding Techniques |
title_full | A Review of Silver Wire Bonding Techniques |
title_fullStr | A Review of Silver Wire Bonding Techniques |
title_full_unstemmed | A Review of Silver Wire Bonding Techniques |
title_short | A Review of Silver Wire Bonding Techniques |
title_sort | review of silver wire bonding techniques |
topic | Review |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10673367/ https://www.ncbi.nlm.nih.gov/pubmed/38004986 http://dx.doi.org/10.3390/mi14112129 |
work_keys_str_mv | AT anbin areviewofsilverwirebondingtechniques AT zhouhongliang areviewofsilverwirebondingtechniques AT caojun areviewofsilverwirebondingtechniques AT mingpingmei areviewofsilverwirebondingtechniques AT persicjohn areviewofsilverwirebondingtechniques AT yaojingguang areviewofsilverwirebondingtechniques AT changandong areviewofsilverwirebondingtechniques AT anbin reviewofsilverwirebondingtechniques AT zhouhongliang reviewofsilverwirebondingtechniques AT caojun reviewofsilverwirebondingtechniques AT mingpingmei reviewofsilverwirebondingtechniques AT persicjohn reviewofsilverwirebondingtechniques AT yaojingguang reviewofsilverwirebondingtechniques AT changandong reviewofsilverwirebondingtechniques |