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Micro-Finned Nanocomposite Films for Enhanced Transport Properties: Graphite Nanoplatelet-Filled Linear Low-Density Polyethylene

Metals are being replaced with high-performance and lightweight polymers, but their low thermal conductivity and poor electrostatic dissipative properties are significant problems. For the protection of sensitive electronic circuitry in automotive and aerospace parts, some device housing materials m...

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Detalles Bibliográficos
Autores principales: Kanhere, Sagar V., Güzdemir, Özgün, Ogale, Amod A.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10675350/
https://www.ncbi.nlm.nih.gov/pubmed/38006136
http://dx.doi.org/10.3390/polym15224411
Descripción
Sumario:Metals are being replaced with high-performance and lightweight polymers, but their low thermal conductivity and poor electrostatic dissipative properties are significant problems. For the protection of sensitive electronic circuitry in automotive and aerospace parts, some device housing materials must provide electrostatic discharge and dissipate heat generated at higher rates as electronic circuits are increasingly miniaturized. Micro-texturing on the film surface can greatly enhance the heat dissipation area and was investigated in this study using low-cost graphite nanoplatelet (GNP)-filled LLDPE films. Micro-finned films (30 vol% GNP) having a 51 ± 10% larger heat-dissipation area were successfully produced using a continuous extrusion process. The through-thickness thermal conductivity of 30 vol% GNP-filled LLDPE was measured at 1.3 W/m·K, which represents a 200% improvement over that of pure LLDPE. For a GNP content of 30 vol%, the surface and volume electrical conductivity of the composite films also increased by 8 orders of magnitude (resistivity down from ≈10(15) to 10(7) Ω·cm) and electrostatic decay time reduced to a below-resolution limit of 0.01 s, at par with military standard requirements. Thus, micro-fin textured GNP-LLDPE offers a unique combination of electrical and thermal transport desired for the protection of electronic encapsulation materials.