Cargando…
Hybrid solder joints: the effect of nanosized ZrO(2) particles on morphology of as-reflowed and thermally aged Sn–3.5Ag solder joints
The main number of current researches has been focused on the microstructure and mechanical properties of the Sn-based Sn–Ag–Cu-based solders, while various kinds of nanosized particles have been added. The synthesis and handling of ceramic nanosized powder are much easier than of metal nanoparticle...
Autores principales: | Wodak, Irina, Yakymovych, Andriy, Svec, Peter, Orovcik, Lubomir, Khatibi, Golta |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Springer International Publishing
2023
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10687115/ https://www.ncbi.nlm.nih.gov/pubmed/38046828 http://dx.doi.org/10.1007/s13204-023-02912-4 |
Ejemplares similares
-
Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis
por: Amli, Siti Farahnabilah Muhd, et al.
Publicado: (2023) -
Enthalpy Effect of Adding Cobalt to Liquid Sn-3.8Ag-0.7Cu
Lead-Free Solder Alloy: Difference between Bulk and Nanosized Cobalt
por: Yakymovych, Andriy, et al.
Publicado: (2016) -
Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures
por: Chen, Chaoyu, et al.
Publicado: (2022) -
Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength
por: Atieh, Anas M., et al.
Publicado: (2019) -
The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints
por: Kang, Min-Soo, et al.
Publicado: (2019)