Fe(3)O(4) microplate filled PEI matrix composite with remarkable nonlinear conductive characteristics, dielectric property, and low percolation threshold

As the presence of a percolating network formed by filler is indispensable for field grading composite, particulate fillers often result in high filler content that can be unfavorable in some aspects. The utilization of fillers with high aspect ratio is an effective way of reducing percolation threshold. In this work, Fe(3)O(4) microplate (FMP) was prepared by a PVP-assisted hydrothermal method and it was adopted to fabricate composite films with different filler content by using polyetherimide (PEI) as the matrix. The composite film exhibited a percolation threshold of approximately 8 phr. The nonlinear coefficient measured 6.28 at a filler content of 10 phr. The nonlinearity in the conductive behavior of the composites was attributed to tunneling effect and Schottky emission. The filling of the FMP into PEI resulted in increase in dielectric constant and the dielectric loss maintained low. This study suggests that the FMP is a promising filler of low-filler-content field grading composite.