Cargando…

Study on the preparation and properties of Sn–0.7Cu–xBi alloy

This study investigated the impact of different bismuth (Bi) contents on the mechanical properties, melting point, and corrosion resistance of tin–copper (Sn–Cu) series alloys (Sn–0.7Cu). Furthermore, Sn–0.7Cu–xBi alloys with different Bi contents (x = 0, 3, 6, 9, 12, 15 wt%) were prepared through a...

Descripción completa

Detalles Bibliográficos
Autores principales:	Shenggang, Zhou, Yi, Zhang, Jihao, Duan, Anyu, Yue, Yong, Cao
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	The Royal Society of Chemistry 2023
Materias:	Chemistry
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10694794/ http://dx.doi.org/10.1039/d3ra06742d

Ejemplares similares

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy
por: Roduan, Siti Faqihah, et al.
Publicado: (2022)

The Effect of Rare Earths Additions on the Microstructure and the Corrosion Behavior of Sn-0.7Cu-0.075Al Solder Alloy
por: Yang, Wenchao, et al.
Publicado: (2019)

Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys
por: Skwarek, Agata, et al.
Publicado: (2021)

Discovery of asymmetric NaXBi (X= Sn /Pb) monolayers with non-trivial topological properties
por: Jia, Yi-zhen, et al.
Publicado: (2018)

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2021)

Viscosity and Electrical Conductivity of the Liquid Sn-3.8Ag-0.7Cu Alloy with Minor Co Admixtures
por: Yakymovych, A., et al.
Publicado: (2016)

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb
por: Skwarek, Agata, et al.
Publicado: (2020)

Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2023)

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing
por: Ramli, Mohd Izrul Izwan, et al.
Publicado: (2021)

Enhancement of Thermoelectric Performance for CuCl Doped P-Type Cu(2)Sn(0.7)Co(0.3)S(3)
por: Shi, Dong-Liang, et al.
Publicado: (2023)

Low Conductivity Decay of Sn–0.7Cu–0.2Zn Photovoltaic Ribbons for Solar Cell Application
por: Chen, Kuan-Jen, et al.
Publicado: (2019)

Enthalpy Effect of Adding Cobalt to Liquid Sn-3.8Ag-0.7Cu Lead-Free Solder Alloy: Difference between Bulk and Nanosized Cobalt
por: Yakymovych, Andriy, et al.
Publicado: (2016)

Structural, optical and microwave dielectric properties of Ba(Ti(1−x)Sn(x))(4)O(9), 0 ≤ x ≤ 0.7 ceramics
por: Ali, Asad, et al.
Publicado: (2021)

Influence of electric current pulses on the solidification of Cu-Bi-Sn immiscible alloys
por: Hongxiang, Jiang, et al.
Publicado: (2015)

Effect of Bi Content on the Microstructure, Mechanical and Tribological Properties of Cu-Sn Alloy
por: Shi, Zhenhua, et al.
Publicado: (2023)

Microstructures and Properties of Sn2.5Ag0.7Cu0.1RE Composite Solders Reinforced with Cu-Coated Graphene Nanosheets Synthesized by Pyrolysis
por: Zhang, Meng, et al.
Publicado: (2019)

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling
por: Cui, Jianguo, et al.
Publicado: (2021)

The XBI BioLab for life science experiments at the European XFEL
por: Han, Huijong, et al.
Publicado: (2021)

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints
por: Zhang, Chao, et al.
Publicado: (2023)

Study of Electroless-Deposited Zn on the Surface of Mg-Li Alloy
por: Yue, Anyu, et al.
Publicado: (2023)

Magnetic Properties and Microstructure of FeCoNi(CuAl)(0.8)Sn(x) (0 ≤ x ≤ 0.10) High-Entropy Alloys
por: Li, Zhong, et al.
Publicado: (2018)

Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy Wire
por: Zhou, Hongliang, et al.
Publicado: (2023)

Composition design, electrical properties, and temperature stability in (1 − x)K(0.44)Na(0.56)Nb(0.96)Sb(0.04)O(3)-xBi(0.45)La(0.05)Na(0.5)ZrO(3) lead-free ceramics
por: Ma, Jian, et al.
Publicado: (2018)

Results on 0.7% X0 thick pixel modules for the ATLAS detector
por: Netchaeva, P, et al.
Publicado: (2001)

Correction: Composition design, electrical properties, and temperature stability in (1 − x)K(0.44)Na(0.56)Nb(0.96)Sb(0.04)O(3)-xBi(0.45)La(0.05)Na(0.5)ZrO(3) lead-free ceramics
por: Ma, Jian, et al.
Publicado: (2020)

Hot Deformation Behavior of Cu–Sn–La Polycrystalline Alloy Prepared by Upcasting
por: Hua, Siming, et al.
Publicado: (2020)

Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging
por: Zhao, Di, et al.
Publicado: (2020)

Non-ambient X-ray and neutron diffraction of novel relaxor ferroelectric xBi(2)(Zn(2/3),Nb(1/3))O(3)–(1 – x)BaTiO(3)
por: Marshall, Jessica, et al.
Publicado: (2021)

Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
por: Shen, Yu-An, et al.
Publicado: (2019)

Impact of the Dopant Species on the Thermomechanical Material Properties of Thermoelectric Mg(2)Si(0.3)Sn(0.7)
por: Castillo-Hernández, Gustavo, et al.
Publicado: (2022)

The effect of excess selenium on the opto-electronic properties of Cu(2)ZnSnSe(4) prepared from Cu–Sn alloy precursors
por: Taskesen, Teoman, et al.
Publicado: (2019)

Selective interlayer ferromagnetic coupling between the Cu spins in YBa(2)Cu(3)O(7−x) grown on top of La(0.7)Ca(0.3)MnO(3)
por: Huang, S. W., et al.
Publicado: (2015)

Tuning of the Structure and Magnetocaloric Effect of Mn(1−x)Zr(x)CoGe Alloys (Where x = 0.03, 0.05, 0.07, and 0.1)
por: Kutynia, Karolina, et al.
Publicado: (2021)

Orientation Relationships in Al(0.7)CoCrFeNi High-Entropy Alloy
por: de Jeer, Leo T.H., et al.
Publicado: (2017)

Thermodynamic properties of liquid Au–Bi–Sn alloys
por: Guo, Zhongnan, et al.
Publicado: (2012)

Author Correction: Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
por: Shen, Yu-An, et al.
Publicado: (2020)

Interface Effects on Magnetic Flux Pinning in La(0.7)Sr(0.3)MnO(3)/YBa (2)Cu(3)O(7–x) Bilayers
por: Chaudhuri, Sayan, et al.
Publicado: (2023)

Microstructure and Mechanical Properties of Friction Stir-Welded Dissimilar Joints of ZK60 and Mg-4.6Al-1.2Sn-0.7Zn Alloys
por: Xie, Liangwen, et al.
Publicado: (2021)

Effect on Local Structure and Phase Transition of Perovskite-Type [N(CH(3))(4)](2)Zn(1-x)Cu(x)Br(4) (x = 0, 0.5, 0.7, and 1) Crystals with the Various Doping of Cu(2+) Ions
por: Lim, Ae Ran
Publicado: (2018)

The crystal structure of (Nb$_{0.75}$Cu$_{0.25}$)Sn$_{2}$ in the Cu-Nb-Sn system
por: Martin, Stefan, et al.
Publicado: (2016)

Cannot write session to /tmp/vufind_sessions/sess_a36m4q8iiblpc8gnfqmngmhpjj