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Mold Fabrication for 3D Dual Damascene Imprinting
Previously, a damascene process based on nanoimprint lithography has been proposed (Schmid G M, et al. in J Vac Sci Technol B 24(3) 1283, 2006) to greatly reduce the fabrication steps of metal interconnection in integrated circuit. For such a process to become a viable technique, a mold having two p...
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| Formato: | Texto |
| Lenguaje: | English |
| Publicado: |
Springer
2010
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC2893711/ https://www.ncbi.nlm.nih.gov/pubmed/20671781 http://dx.doi.org/10.1007/s11671-010-9540-2 |