Multiscale Simulation of Indentation, Retraction and Fracture Processes of Nanocontact

The process of nanocontact including indentation and retraction between a large Ni tip and a Cu substrate is investigated using quasicontinuum (QC) method. The multiscale model reveals that significant plastic deformation occurs during the process of nanocontact between Ni tip and Cu substrate. Plas...

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Detalles Bibliográficos
Autores principales: Mei, Jifa, Li, Junwan, Ni, Yushan, Wang, Huatao
Formato: Texto
Lenguaje:English
Publicado: Springer 2010
Materias:
Nano Express
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC2894359/
https://www.ncbi.nlm.nih.gov/pubmed/20672044
http://dx.doi.org/10.1007/s11671-010-9533-1

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC2894359/
https://www.ncbi.nlm.nih.gov/pubmed/20672044
http://dx.doi.org/10.1007/s11671-010-9533-1

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