Cargando…
Multiscale Simulation of Indentation, Retraction and Fracture Processes of Nanocontact
The process of nanocontact including indentation and retraction between a large Ni tip and a Cu substrate is investigated using quasicontinuum (QC) method. The multiscale model reveals that significant plastic deformation occurs during the process of nanocontact between Ni tip and Cu substrate. Plas...
| Autores principales: | , , , |
|---|---|
| Formato: | Texto |
| Lenguaje: | English |
| Publicado: |
Springer
2010
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC2894359/ https://www.ncbi.nlm.nih.gov/pubmed/20672044 http://dx.doi.org/10.1007/s11671-010-9533-1 |