Enthalpies of mixing of liquid systems for lead free soldering: Al–Cu–Sn system

The present work refers to high-temperature drop calorimetric measurements on liquid Al–Cu, Al–Sn, and Al–Cu–Sn alloys. The binary systems have been investigated at 973 K, up to 40 at.% Cu in case of Al–Cu, and over the entire concentrational range in case of Al–Sn. Measurements in the ternary Al–Cu–Sn system were performed along the following cross-sections: x(Al)/x(Cu) = 1:1, x(Al)/x(Sn) = 1:1, x(Cu)/x(Sn) = 7:3, x(Cu)/x(Sn) = 1:1, and x(Cu)/x(Sn) = 3:7 at 1273 K. Experimental data were used to find ternary interaction parameters by applying the Redlich–Kister–Muggianu model for substitutional solutions, and a full set of parameters describing the concentration dependence of the enthalpy of mixing was derived. From these, the isoenthalpy curves were constructed for 1273 K. The ternary system shows an exothermic enthalpy minimum of approx. −18,000 J/mol in the Al–Cu binary and a maximum of approx. 4000 J/mol in the Al–Sn binary system. The Al–Cu–Sn system is characterized by considerable repulsive ternary interactions as shown by the positive ternary interaction parameters.