A compact model for early electromigration failures of copper dual-damascene interconnects

A compact model for early electromigration failures in copper dual-damascene interconnects is proposed. The model is based on the combination of a complete void nucleation model together with a simple mechanism of slit void growth under the via. It is demonstrated that the early electromigration lif...

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Detalles Bibliográficos
Autores principales: de Orio, R.L., Ceric, H., Selberherr, S.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Pergamon Press 2011
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3178013/
https://www.ncbi.nlm.nih.gov/pubmed/21966026
http://dx.doi.org/10.1016/j.microrel.2011.07.049
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author de Orio, R.L.
Ceric, H.
Selberherr, S.
author_facet de Orio, R.L.
Ceric, H.
Selberherr, S.
author_sort de Orio, R.L.
collection PubMed
description A compact model for early electromigration failures in copper dual-damascene interconnects is proposed. The model is based on the combination of a complete void nucleation model together with a simple mechanism of slit void growth under the via. It is demonstrated that the early electromigration lifetime is well described by a simple analytical expression, from where a statistical distribution can be conveniently obtained. Furthermore, it is shown that the simulation results provide a reasonable estimation for the lifetimes.
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spelling pubmed-31780132011-09-30 A compact model for early electromigration failures of copper dual-damascene interconnects de Orio, R.L. Ceric, H. Selberherr, S. Microelectron Reliab Article A compact model for early electromigration failures in copper dual-damascene interconnects is proposed. The model is based on the combination of a complete void nucleation model together with a simple mechanism of slit void growth under the via. It is demonstrated that the early electromigration lifetime is well described by a simple analytical expression, from where a statistical distribution can be conveniently obtained. Furthermore, it is shown that the simulation results provide a reasonable estimation for the lifetimes. Pergamon Press 2011-09 /pmc/articles/PMC3178013/ /pubmed/21966026 http://dx.doi.org/10.1016/j.microrel.2011.07.049 Text en © 2011 Elsevier Ltd. https://creativecommons.org/licenses/by-nc-nd/3.0/ Open Access under CC BY-NC-ND 3.0 (https://creativecommons.org/licenses/by-nc-nd/3.0/) license
spellingShingle Article
de Orio, R.L.
Ceric, H.
Selberherr, S.
A compact model for early electromigration failures of copper dual-damascene interconnects
title A compact model for early electromigration failures of copper dual-damascene interconnects
title_full A compact model for early electromigration failures of copper dual-damascene interconnects
title_fullStr A compact model for early electromigration failures of copper dual-damascene interconnects
title_full_unstemmed A compact model for early electromigration failures of copper dual-damascene interconnects
title_short A compact model for early electromigration failures of copper dual-damascene interconnects
title_sort compact model for early electromigration failures of copper dual-damascene interconnects
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3178013/
https://www.ncbi.nlm.nih.gov/pubmed/21966026
http://dx.doi.org/10.1016/j.microrel.2011.07.049
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