A compact model for early electromigration failures of copper dual-damascene interconnects

A compact model for early electromigration failures in copper dual-damascene interconnects is proposed. The model is based on the combination of a complete void nucleation model together with a simple mechanism of slit void growth under the via. It is demonstrated that the early electromigration lif...

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Detalles Bibliográficos
Autores principales: de Orio, R.L., Ceric, H., Selberherr, S.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Pergamon Press 2011
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3178013/
https://www.ncbi.nlm.nih.gov/pubmed/21966026
http://dx.doi.org/10.1016/j.microrel.2011.07.049

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3178013/
https://www.ncbi.nlm.nih.gov/pubmed/21966026
http://dx.doi.org/10.1016/j.microrel.2011.07.049

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