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A compact model for early electromigration failures of copper dual-damascene interconnects
A compact model for early electromigration failures in copper dual-damascene interconnects is proposed. The model is based on the combination of a complete void nucleation model together with a simple mechanism of slit void growth under the via. It is demonstrated that the early electromigration lif...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Pergamon Press
2011
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3178013/ https://www.ncbi.nlm.nih.gov/pubmed/21966026 http://dx.doi.org/10.1016/j.microrel.2011.07.049 |