Implementation of the CMOS MEMS Condenser Microphone with Corrugated Metal Diaphragm and Silicon Back-Plate

This study reports a CMOS-MEMS condenser microphone implemented using the standard thin film stacking of 0.35 μm UMC CMOS 3.3/5.0 V logic process, and followed by post-CMOS micromachining steps without introducing any special materials. The corrugated diaphragm for the microphone is designed and imp...

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Detalles Bibliográficos
Autores principales: Huang, Chien-Hsin, Lee, Chien-Hsing, Hsieh, Tsung-Min, Tsao, Li-Chi, Wu, Shaoyi, Liou, Jhyy-Cheng, Wang, Ming-Yi, Chen, Li-Che, Yip, Ming-Chuen, Fang, Weileun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Molecular Diversity Preservation International (MDPI) 2011
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3231452/
https://www.ncbi.nlm.nih.gov/pubmed/22163953
http://dx.doi.org/10.3390/s110606257

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