Cargando…
An Organic Metal/Silver Nanoparticle Finish on Copper for Efficient Passivation and Solderability Preservation
For the first time, a complex formed by polyaniline (in its organic metal form) and silver has been deposited on copper in nanoparticulate form. When depositing on Cu pads of printed circuit boards it efficiently protects against oxidation and preserves its solderability. The deposited layer has a t...
| Autores principales: | , , , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer
2007
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3246595/ http://dx.doi.org/10.1007/s11671-007-9086-0 |