Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices

This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with e...

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Detalles Bibliográficos
Autores principales: Zaal, Jeroen J. M., van Driel, Willem D., Zhang, G.Q.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Molecular Diversity Preservation International (MDPI) 2010
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3274256/
https://www.ncbi.nlm.nih.gov/pubmed/22319337
http://dx.doi.org/10.3390/s100403989
Descripción
Sumario:This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate the assembly risks. Our results emphasize the need for concurrent design for assembly.

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