Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices

This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with e...

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Detalles Bibliográficos
Autores principales: Zaal, Jeroen J. M., van Driel, Willem D., Zhang, G.Q.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Molecular Diversity Preservation International (MDPI) 2010
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3274256/
https://www.ncbi.nlm.nih.gov/pubmed/22319337
http://dx.doi.org/10.3390/s100403989

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3274256/
https://www.ncbi.nlm.nih.gov/pubmed/22319337
http://dx.doi.org/10.3390/s100403989

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