A High Sensitivity Three-Dimensional-Shape Sensing Patch Prepared by Lithography and Inkjet Printing

A process combining conventional photolithography and a novel inkjet printing method for the manufacture of high sensitivity three-dimensional-shape (3DS) sensing patches was proposed and demonstrated. The supporting curvature ranges from 1.41 to 6.24 × 10(−2) mm(−1) and the sensing patch has a thic...

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Detalles Bibliográficos
Autores principales: Huang, Yi-Ren, Kuo, Sheng-An, Stach, Michal, Liu, Chia-Hsing, Liao, Kuan-Hsun, Lo, Cheng-Yao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Molecular Diversity Preservation International (MDPI) 2012
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3355406/
https://www.ncbi.nlm.nih.gov/pubmed/22666025
http://dx.doi.org/10.3390/s120404172

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3355406/
https://www.ncbi.nlm.nih.gov/pubmed/22666025
http://dx.doi.org/10.3390/s120404172

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