A Non-Adhesive Solid-Gel Electrode for a Non-Invasive Brain–Machine Interface

A non-invasive brain–machine interface (BMI) or brain–computer interface is a technology for helping individuals with disabilities and utilizes neurophysiological signals from the brain to control external machines or computers without requiring surgery. However, when applying electroencephalography (EEG) methodology, users must place EEG electrodes on the scalp each time, and the development of easy-to-use electrodes for clinical use is required. In this study, we developed a conductive non-adhesive solid-gel electrode for practical non-invasive BMIs. We performed basic material testing, including examining the volume resistivity, viscoelasticity, and moisture-retention properties of the solid-gel. Then, we compared the performance of the solid-gel, a conventional paste, and an in-house metal-pin-based electrode using impedance measurements and P300-BMI testing. The solid-gel was observed to be conductive (volume resistivity 13.2 Ωcm) and soft (complex modulus 105.4 kPa), and it remained wet for a prolonged period (>10 h) in a dry environment. Impedance measurements revealed that the impedance of the solid-gel-based and conventional paste-based electrodes was superior to that of the pin-based electrode. The EEG measurement suggested that the signals obtained with the solid-gel electrode were comparable to those with the conventional paste-based electrode. Moreover, the P300-BMI study suggested that systems using the solid-gel or pin-based electrodes were effective. One of the advantages of the solid-gel is that it does not require cleaning after use, whereas the conventional paste adheres to the hair, which requires washing. Furthermore, the solid-gel electrode was not painful compared with a metal-pin electrode. Taken together, the results suggest that the solid-gel electrode worked well for practical BMIs and could be useful for bedridden patients such as those with amyotrophic lateral sclerosis.