Cargando…

Quantitative Exposure Assessment of Various Chemical Substances in a Wafer Fabrication Industry Facility

OBJECTIVES: This study was designed to evaluate exposure levels of various chemicals used in wafer fabrication product lines in the semiconductor industry where work-related leukemia has occurred. METHODS: The research focused on 9 representative wafer fabrication bays among a total of 25 bays in a...

Descripción completa

Detalles Bibliográficos
Autores principales: Park, Hyunhee, Jang, Jae-Kil, Shin, Jung-Ah
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Occupational Safety and Health Research Institute 2011
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3431888/
https://www.ncbi.nlm.nih.gov/pubmed/22953186
http://dx.doi.org/10.5491/SHAW.2011.2.1.39
_version_ 1782242124496896000
author Park, Hyunhee
Jang, Jae-Kil
Shin, Jung-Ah
author_facet Park, Hyunhee
Jang, Jae-Kil
Shin, Jung-Ah
author_sort Park, Hyunhee
collection PubMed
description OBJECTIVES: This study was designed to evaluate exposure levels of various chemicals used in wafer fabrication product lines in the semiconductor industry where work-related leukemia has occurred. METHODS: The research focused on 9 representative wafer fabrication bays among a total of 25 bays in a semiconductor product line. We monitored the chemical substances categorized as human carcinogens with respect to leukemia as well as harmful chemicals used in the bays and substances with hematologic and reproductive toxicities to evaluate the overall health effect for semiconductor industry workers. With respect to monitoring, active and passive sampling techniques were introduced. Eight-hour long-term and 15-minute short-term sampling was conducted for the area as well as on personal samples. RESULTS: The results of the measurements for each substance showed that benzene, toluene, xylene, n-butyl acetate, 2-methoxyethanol, 2-heptanone, ethylene glycol, sulfuric acid, and phosphoric acid were non-detectable (ND) in all samples. Arsine was either "ND" or it existed only in trace form in the bay air. The maximum exposure concentration of fluorides was approximately 0.17% of the Korea occupational exposure limits, with hydrofluoric acid at about 0.2%, hydrochloric acid 0.06%, nitric acid 0.05%, isopropyl alcohol 0.4%, and phosphine at about 2%. The maximum exposure concentration of propylene glycol monomethyl ether acetate (PGMEA) was 0.0870 ppm, representing only 0.1% or less than the American Industrial Hygiene Association recommended standard (100 ppm). CONCLUSION: Benzene, a known human carcinogen for leukemia, and arsine, a hematologic toxin, were not detected in wafer fabrication sites in this study. Among reproductive toxic substances, n-butyl acetate was not detected, but fluorides and PGMEA existed in small amounts in the air. This investigation was focused on the air-borne chemical concentrations only in regular working conditions. Unconditional exposures during spills and/or maintenance tasks and by-product chemicals were not included. Supplementary studies might be required.
format Online
Article
Text
id pubmed-3431888
institution National Center for Biotechnology Information
language English
publishDate 2011
publisher Occupational Safety and Health Research Institute
record_format MEDLINE/PubMed
spelling pubmed-34318882012-09-05 Quantitative Exposure Assessment of Various Chemical Substances in a Wafer Fabrication Industry Facility Park, Hyunhee Jang, Jae-Kil Shin, Jung-Ah Saf Health Work Original Article OBJECTIVES: This study was designed to evaluate exposure levels of various chemicals used in wafer fabrication product lines in the semiconductor industry where work-related leukemia has occurred. METHODS: The research focused on 9 representative wafer fabrication bays among a total of 25 bays in a semiconductor product line. We monitored the chemical substances categorized as human carcinogens with respect to leukemia as well as harmful chemicals used in the bays and substances with hematologic and reproductive toxicities to evaluate the overall health effect for semiconductor industry workers. With respect to monitoring, active and passive sampling techniques were introduced. Eight-hour long-term and 15-minute short-term sampling was conducted for the area as well as on personal samples. RESULTS: The results of the measurements for each substance showed that benzene, toluene, xylene, n-butyl acetate, 2-methoxyethanol, 2-heptanone, ethylene glycol, sulfuric acid, and phosphoric acid were non-detectable (ND) in all samples. Arsine was either "ND" or it existed only in trace form in the bay air. The maximum exposure concentration of fluorides was approximately 0.17% of the Korea occupational exposure limits, with hydrofluoric acid at about 0.2%, hydrochloric acid 0.06%, nitric acid 0.05%, isopropyl alcohol 0.4%, and phosphine at about 2%. The maximum exposure concentration of propylene glycol monomethyl ether acetate (PGMEA) was 0.0870 ppm, representing only 0.1% or less than the American Industrial Hygiene Association recommended standard (100 ppm). CONCLUSION: Benzene, a known human carcinogen for leukemia, and arsine, a hematologic toxin, were not detected in wafer fabrication sites in this study. Among reproductive toxic substances, n-butyl acetate was not detected, but fluorides and PGMEA existed in small amounts in the air. This investigation was focused on the air-borne chemical concentrations only in regular working conditions. Unconditional exposures during spills and/or maintenance tasks and by-product chemicals were not included. Supplementary studies might be required. Occupational Safety and Health Research Institute 2011-03 2011-03-31 /pmc/articles/PMC3431888/ /pubmed/22953186 http://dx.doi.org/10.5491/SHAW.2011.2.1.39 Text en Copyright © 2011 by Safety and Health at Work (SH@W) http://creativecommons.org/licenses/by-nc/3.0 This is an open-access article distributed under the terms of the Creative Commons Attribution Non-Commercial License (http://creativecommons.org/licenses/by-nc/3.0/), which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited.
spellingShingle Original Article
Park, Hyunhee
Jang, Jae-Kil
Shin, Jung-Ah
Quantitative Exposure Assessment of Various Chemical Substances in a Wafer Fabrication Industry Facility
title Quantitative Exposure Assessment of Various Chemical Substances in a Wafer Fabrication Industry Facility
title_full Quantitative Exposure Assessment of Various Chemical Substances in a Wafer Fabrication Industry Facility
title_fullStr Quantitative Exposure Assessment of Various Chemical Substances in a Wafer Fabrication Industry Facility
title_full_unstemmed Quantitative Exposure Assessment of Various Chemical Substances in a Wafer Fabrication Industry Facility
title_short Quantitative Exposure Assessment of Various Chemical Substances in a Wafer Fabrication Industry Facility
title_sort quantitative exposure assessment of various chemical substances in a wafer fabrication industry facility
topic Original Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3431888/
https://www.ncbi.nlm.nih.gov/pubmed/22953186
http://dx.doi.org/10.5491/SHAW.2011.2.1.39
work_keys_str_mv AT parkhyunhee quantitativeexposureassessmentofvariouschemicalsubstancesinawaferfabricationindustryfacility
AT jangjaekil quantitativeexposureassessmentofvariouschemicalsubstancesinawaferfabricationindustryfacility
AT shinjungah quantitativeexposureassessmentofvariouschemicalsubstancesinawaferfabricationindustryfacility