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Enthalpy of mixing of liquid systems for lead free soldering: Ni–Sb–Sn system
The partial and integral enthalpies of mixing of liquid ternary Ni–Sb–Sn alloys were determined along five sections x(Sb)/x(Sn) = 3:1, x(Sb)/x(Sn) = 1:1, x(Sb)/x(Sn) = 1:3, x(Ni)/x(Sn) = 1:4, and x(Ni)/x(Sb) = 1:4 at 1000 °C in a large compositional range using drop calorimetry techniques. The mixin...
Autores principales: | , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Elsevier
2012
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3587467/ https://www.ncbi.nlm.nih.gov/pubmed/23471085 http://dx.doi.org/10.1016/j.tca.2012.01.024 |
Sumario: | The partial and integral enthalpies of mixing of liquid ternary Ni–Sb–Sn alloys were determined along five sections x(Sb)/x(Sn) = 3:1, x(Sb)/x(Sn) = 1:1, x(Sb)/x(Sn) = 1:3, x(Ni)/x(Sn) = 1:4, and x(Ni)/x(Sb) = 1:4 at 1000 °C in a large compositional range using drop calorimetry techniques. The mixing enthalpy of Ni–Sb alloys was determined at the same temperature and described by a Redlich–Kister polynomial. The other binary data were carefully evaluated from literature values. Our measured ternary data were fitted on the basis of an extended Redlich–Kister–Muggianu model for substitutional solutions. Additionally, a comparison of these results to the extrapolation model of Toop is given. The entire ternary system shows exothermic values of Δ(mix)H ranging from approx. −1300 J/mol, the minimum in the Sb–Sn binary system down to approx. −24,500 J/mol towards Ni–Sb. No significant ternary interaction could be deduced from our data. |
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