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Thermal Strain Analysis of Optic Fiber Sensors
An optical fiber sensor surface bonded onto a host structure and subjected to a temperature change is analytically studied in this work. The analysis is developed in order to assess the thermal behavior of an optical fiber sensor designed for measuring the strain in the host structure. For a surface...
Autores principales: | , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Molecular Diversity Preservation International (MDPI)
2013
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3649389/ https://www.ncbi.nlm.nih.gov/pubmed/23385407 http://dx.doi.org/10.3390/s130201846 |
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author | Her, Shiuh-Chuan Huang, Chih-Ying |
author_facet | Her, Shiuh-Chuan Huang, Chih-Ying |
author_sort | Her, Shiuh-Chuan |
collection | PubMed |
description | An optical fiber sensor surface bonded onto a host structure and subjected to a temperature change is analytically studied in this work. The analysis is developed in order to assess the thermal behavior of an optical fiber sensor designed for measuring the strain in the host structure. For a surface bonded optical fiber sensor, the measuring sensitivity is strongly dependent on the bonding characteristics which include the protective coating, adhesive layer and the bonding length. Thermal stresses can be generated due to a mismatch of thermal expansion coefficients between the optical fiber and host structure. The optical fiber thermal strain induced by the host structure is transferred via the adhesive layer and protective coating. In this investigation, an analytical expression of the thermal strain and stress in the optical fiber is presented. The theoretical predictions are validated using the finite element method. Numerical results show that the thermal strain and stress are linearly dependent on the difference in thermal expansion coefficients between the optical fiber and host structure and independent of the thermal expansion coefficients of the adhesive and coating. |
format | Online Article Text |
id | pubmed-3649389 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2013 |
publisher | Molecular Diversity Preservation International (MDPI) |
record_format | MEDLINE/PubMed |
spelling | pubmed-36493892013-06-04 Thermal Strain Analysis of Optic Fiber Sensors Her, Shiuh-Chuan Huang, Chih-Ying Sensors (Basel) Article An optical fiber sensor surface bonded onto a host structure and subjected to a temperature change is analytically studied in this work. The analysis is developed in order to assess the thermal behavior of an optical fiber sensor designed for measuring the strain in the host structure. For a surface bonded optical fiber sensor, the measuring sensitivity is strongly dependent on the bonding characteristics which include the protective coating, adhesive layer and the bonding length. Thermal stresses can be generated due to a mismatch of thermal expansion coefficients between the optical fiber and host structure. The optical fiber thermal strain induced by the host structure is transferred via the adhesive layer and protective coating. In this investigation, an analytical expression of the thermal strain and stress in the optical fiber is presented. The theoretical predictions are validated using the finite element method. Numerical results show that the thermal strain and stress are linearly dependent on the difference in thermal expansion coefficients between the optical fiber and host structure and independent of the thermal expansion coefficients of the adhesive and coating. Molecular Diversity Preservation International (MDPI) 2013-01-31 /pmc/articles/PMC3649389/ /pubmed/23385407 http://dx.doi.org/10.3390/s130201846 Text en © 2013 by the authors; licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution license (http://creativecommons.org/licenses/by/3.0/). |
spellingShingle | Article Her, Shiuh-Chuan Huang, Chih-Ying Thermal Strain Analysis of Optic Fiber Sensors |
title | Thermal Strain Analysis of Optic Fiber Sensors |
title_full | Thermal Strain Analysis of Optic Fiber Sensors |
title_fullStr | Thermal Strain Analysis of Optic Fiber Sensors |
title_full_unstemmed | Thermal Strain Analysis of Optic Fiber Sensors |
title_short | Thermal Strain Analysis of Optic Fiber Sensors |
title_sort | thermal strain analysis of optic fiber sensors |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3649389/ https://www.ncbi.nlm.nih.gov/pubmed/23385407 http://dx.doi.org/10.3390/s130201846 |
work_keys_str_mv | AT hershiuhchuan thermalstrainanalysisofopticfibersensors AT huangchihying thermalstrainanalysisofopticfibersensors |