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Structural Properties of Liquid SiC during Rapid Solidification

The rapid solidification of liquid silicon carbide (SiC) is studied by molecular dynamic simulation using the Tersoff potential. The structural properties of liquid and amorphous SiC are analyzed by the radial distribution function, angular distribution function, coordination number, and visualizati...

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Detalles Bibliográficos
Autores principales: Yan, WanJun, Gao, TingHong, Guo, XiaoTian, Qin, YunXiang, Xie, Quan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Hindawi Publishing Corporation 2013
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3830806/
https://www.ncbi.nlm.nih.gov/pubmed/24288474
http://dx.doi.org/10.1155/2013/273023
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author Yan, WanJun
Gao, TingHong
Guo, XiaoTian
Qin, YunXiang
Xie, Quan
author_facet Yan, WanJun
Gao, TingHong
Guo, XiaoTian
Qin, YunXiang
Xie, Quan
author_sort Yan, WanJun
collection PubMed
description The rapid solidification of liquid silicon carbide (SiC) is studied by molecular dynamic simulation using the Tersoff potential. The structural properties of liquid and amorphous SiC are analyzed by the radial distribution function, angular distribution function, coordination number, and visualization technology. Results show that both heteronuclear and homonuclear bonds exist and no atomic segregation occurs during solidification. The bond angles of silicon and carbon atoms are distributed at around 109° and 120°, respectively, and the average coordination number is <4. Threefold carbon atoms and fourfold silicon atoms are linked together by six typical structures and ultimately form a random network of amorphous structure. The simulated results help understand the structural properties of liquid and amorphous SiC, as well as other similar semiconductor alloys.
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spelling pubmed-38308062013-11-28 Structural Properties of Liquid SiC during Rapid Solidification Yan, WanJun Gao, TingHong Guo, XiaoTian Qin, YunXiang Xie, Quan ScientificWorldJournal Research Article The rapid solidification of liquid silicon carbide (SiC) is studied by molecular dynamic simulation using the Tersoff potential. The structural properties of liquid and amorphous SiC are analyzed by the radial distribution function, angular distribution function, coordination number, and visualization technology. Results show that both heteronuclear and homonuclear bonds exist and no atomic segregation occurs during solidification. The bond angles of silicon and carbon atoms are distributed at around 109° and 120°, respectively, and the average coordination number is <4. Threefold carbon atoms and fourfold silicon atoms are linked together by six typical structures and ultimately form a random network of amorphous structure. The simulated results help understand the structural properties of liquid and amorphous SiC, as well as other similar semiconductor alloys. Hindawi Publishing Corporation 2013-10-29 /pmc/articles/PMC3830806/ /pubmed/24288474 http://dx.doi.org/10.1155/2013/273023 Text en Copyright © 2013 WanJun Yan et al. https://creativecommons.org/licenses/by/3.0/ This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
spellingShingle Research Article
Yan, WanJun
Gao, TingHong
Guo, XiaoTian
Qin, YunXiang
Xie, Quan
Structural Properties of Liquid SiC during Rapid Solidification
title Structural Properties of Liquid SiC during Rapid Solidification
title_full Structural Properties of Liquid SiC during Rapid Solidification
title_fullStr Structural Properties of Liquid SiC during Rapid Solidification
title_full_unstemmed Structural Properties of Liquid SiC during Rapid Solidification
title_short Structural Properties of Liquid SiC during Rapid Solidification
title_sort structural properties of liquid sic during rapid solidification
topic Research Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3830806/
https://www.ncbi.nlm.nih.gov/pubmed/24288474
http://dx.doi.org/10.1155/2013/273023
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