Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

Detalles Bibliográficos
Autores principales: Chong Leong, Gan, Uda, Hashim
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Public Library of Science 2014
Materias:
Correction
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3879397/
http://dx.doi.org/10.1371/annotation/21a4e441-0c3f-4319-9833-91d316b99d43
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author Chong Leong, Gan
Uda, Hashim
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Uda, Hashim
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spelling pubmed-38793972014-01-03 Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging Chong Leong, Gan Uda, Hashim PLoS One Correction Public Library of Science 2014-01-02 /pmc/articles/PMC3879397/ http://dx.doi.org/10.1371/annotation/21a4e441-0c3f-4319-9833-91d316b99d43 Text en © 2014 Public Library of Science http://creativecommons.org/licenses/by/4.0/ This is an open-access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are properly credited.
spellingShingle Correction
Chong Leong, Gan
Uda, Hashim
Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
title Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
title_full Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
title_fullStr Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
title_full_unstemmed Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
title_short Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging
title_sort correction: comparative reliability studies and analysis of au, pd-coated cu and pd-doped cu wire in microelectronics packaging
topic Correction
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC3879397/
http://dx.doi.org/10.1371/annotation/21a4e441-0c3f-4319-9833-91d316b99d43
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AT udahashim correctioncomparativereliabilitystudiesandanalysisofaupdcoatedcuandpddopedcuwireinmicroelectronicspackaging

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