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Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate
Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-butadiene-styrene (ABS) substrate via electroless c...
Autores principales: | , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Molecular Diversity Preservation International (MDPI)
2014
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4013637/ https://www.ncbi.nlm.nih.gov/pubmed/24739812 http://dx.doi.org/10.3390/ijms15046412 |
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author | Xu, Jiushuai Fan, Ruibin Wang, Jiaolong Jia, Mengke Xiong, Xuanrui Wang, Fang |
author_facet | Xu, Jiushuai Fan, Ruibin Wang, Jiaolong Jia, Mengke Xiong, Xuanrui Wang, Fang |
author_sort | Xu, Jiushuai |
collection | PubMed |
description | Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-butadiene-styrene (ABS) substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Their individual deposition rate and contact angle were also investigated to compare the properties of SAMs and electroless copper films. The results indicated that the formation of copper nuclei on the TES-SAMs modified ABS substrate was faster than those on the MPTMS-SAMs and APTES-SAMs modified ABS substrate. SEM images revealed that the copper film on TES-SAM modified ABS substrate was smooth and uniform, and the density of copper nuclei was much higher. Compared with that of TES-SAMs modified resin, the coverage of copper nuclei on MPTMS and APTES modified ABS substrate was very limited and the copper particle size was too big. The adhesion property test demonstrated that all the SAMs enhanced the interfacial interaction between copper plating and ABS substrate. XRD analysis showed that the copper film deposited on SAM-modified ABS substrate had a structure with Cu(111) preferred orientation, and the copper film deposited on TES-SAMs modified ABS substrate is better than that deposited on MPTMS-SAMs or APTES-SAMs modified ABS resins in electromigrtion resistance. |
format | Online Article Text |
id | pubmed-4013637 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2014 |
publisher | Molecular Diversity Preservation International (MDPI) |
record_format | MEDLINE/PubMed |
spelling | pubmed-40136372014-05-08 Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate Xu, Jiushuai Fan, Ruibin Wang, Jiaolong Jia, Mengke Xiong, Xuanrui Wang, Fang Int J Mol Sci Article Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-butadiene-styrene (ABS) substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Their individual deposition rate and contact angle were also investigated to compare the properties of SAMs and electroless copper films. The results indicated that the formation of copper nuclei on the TES-SAMs modified ABS substrate was faster than those on the MPTMS-SAMs and APTES-SAMs modified ABS substrate. SEM images revealed that the copper film on TES-SAM modified ABS substrate was smooth and uniform, and the density of copper nuclei was much higher. Compared with that of TES-SAMs modified resin, the coverage of copper nuclei on MPTMS and APTES modified ABS substrate was very limited and the copper particle size was too big. The adhesion property test demonstrated that all the SAMs enhanced the interfacial interaction between copper plating and ABS substrate. XRD analysis showed that the copper film deposited on SAM-modified ABS substrate had a structure with Cu(111) preferred orientation, and the copper film deposited on TES-SAMs modified ABS substrate is better than that deposited on MPTMS-SAMs or APTES-SAMs modified ABS resins in electromigrtion resistance. Molecular Diversity Preservation International (MDPI) 2014-04-15 /pmc/articles/PMC4013637/ /pubmed/24739812 http://dx.doi.org/10.3390/ijms15046412 Text en © 2014 by the authors; licensee MDPI, Basel, Switzerland http://creativecommons.org/licenses/by/3.0/ This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution license (http://creativecommons.org/licenses/by/3.0/). |
spellingShingle | Article Xu, Jiushuai Fan, Ruibin Wang, Jiaolong Jia, Mengke Xiong, Xuanrui Wang, Fang Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate |
title | Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate |
title_full | Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate |
title_fullStr | Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate |
title_full_unstemmed | Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate |
title_short | Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate |
title_sort | comparative study of electroless copper film on different self-assembled monolayers modified abs substrate |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4013637/ https://www.ncbi.nlm.nih.gov/pubmed/24739812 http://dx.doi.org/10.3390/ijms15046412 |
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