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Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate

Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-butadiene-styrene (ABS) substrate via electroless c...

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Detalles Bibliográficos
Autores principales: Xu, Jiushuai, Fan, Ruibin, Wang, Jiaolong, Jia, Mengke, Xiong, Xuanrui, Wang, Fang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Molecular Diversity Preservation International (MDPI) 2014
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4013637/
https://www.ncbi.nlm.nih.gov/pubmed/24739812
http://dx.doi.org/10.3390/ijms15046412
_version_ 1782315090509299712
author Xu, Jiushuai
Fan, Ruibin
Wang, Jiaolong
Jia, Mengke
Xiong, Xuanrui
Wang, Fang
author_facet Xu, Jiushuai
Fan, Ruibin
Wang, Jiaolong
Jia, Mengke
Xiong, Xuanrui
Wang, Fang
author_sort Xu, Jiushuai
collection PubMed
description Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-butadiene-styrene (ABS) substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Their individual deposition rate and contact angle were also investigated to compare the properties of SAMs and electroless copper films. The results indicated that the formation of copper nuclei on the TES-SAMs modified ABS substrate was faster than those on the MPTMS-SAMs and APTES-SAMs modified ABS substrate. SEM images revealed that the copper film on TES-SAM modified ABS substrate was smooth and uniform, and the density of copper nuclei was much higher. Compared with that of TES-SAMs modified resin, the coverage of copper nuclei on MPTMS and APTES modified ABS substrate was very limited and the copper particle size was too big. The adhesion property test demonstrated that all the SAMs enhanced the interfacial interaction between copper plating and ABS substrate. XRD analysis showed that the copper film deposited on SAM-modified ABS substrate had a structure with Cu(111) preferred orientation, and the copper film deposited on TES-SAMs modified ABS substrate is better than that deposited on MPTMS-SAMs or APTES-SAMs modified ABS resins in electromigrtion resistance.
format Online
Article
Text
id pubmed-4013637
institution National Center for Biotechnology Information
language English
publishDate 2014
publisher Molecular Diversity Preservation International (MDPI)
record_format MEDLINE/PubMed
spelling pubmed-40136372014-05-08 Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate Xu, Jiushuai Fan, Ruibin Wang, Jiaolong Jia, Mengke Xiong, Xuanrui Wang, Fang Int J Mol Sci Article Copper films were grown on (3-Mercaptopropyl)trimethoxysilane (MPTMS), (3-Aminopropyl)triethoxysilane (APTES) and 6-(3-(triethoxysilyl)propylamino)-1,3,5- triazine-2,4-dithiol monosodium (TES) self-assembled monolayers (SAMs) modified acrylonitrile-butadiene-styrene (ABS) substrate via electroless copper plating. The copper films were examined using scanning electron microscopy (SEM) and X-ray diffraction (XRD). Their individual deposition rate and contact angle were also investigated to compare the properties of SAMs and electroless copper films. The results indicated that the formation of copper nuclei on the TES-SAMs modified ABS substrate was faster than those on the MPTMS-SAMs and APTES-SAMs modified ABS substrate. SEM images revealed that the copper film on TES-SAM modified ABS substrate was smooth and uniform, and the density of copper nuclei was much higher. Compared with that of TES-SAMs modified resin, the coverage of copper nuclei on MPTMS and APTES modified ABS substrate was very limited and the copper particle size was too big. The adhesion property test demonstrated that all the SAMs enhanced the interfacial interaction between copper plating and ABS substrate. XRD analysis showed that the copper film deposited on SAM-modified ABS substrate had a structure with Cu(111) preferred orientation, and the copper film deposited on TES-SAMs modified ABS substrate is better than that deposited on MPTMS-SAMs or APTES-SAMs modified ABS resins in electromigrtion resistance. Molecular Diversity Preservation International (MDPI) 2014-04-15 /pmc/articles/PMC4013637/ /pubmed/24739812 http://dx.doi.org/10.3390/ijms15046412 Text en © 2014 by the authors; licensee MDPI, Basel, Switzerland http://creativecommons.org/licenses/by/3.0/ This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution license (http://creativecommons.org/licenses/by/3.0/).
spellingShingle Article
Xu, Jiushuai
Fan, Ruibin
Wang, Jiaolong
Jia, Mengke
Xiong, Xuanrui
Wang, Fang
Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate
title Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate
title_full Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate
title_fullStr Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate
title_full_unstemmed Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate
title_short Comparative Study of Electroless Copper Film on Different Self-Assembled Monolayers Modified ABS Substrate
title_sort comparative study of electroless copper film on different self-assembled monolayers modified abs substrate
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4013637/
https://www.ncbi.nlm.nih.gov/pubmed/24739812
http://dx.doi.org/10.3390/ijms15046412
work_keys_str_mv AT xujiushuai comparativestudyofelectrolesscopperfilmondifferentselfassembledmonolayersmodifiedabssubstrate
AT fanruibin comparativestudyofelectrolesscopperfilmondifferentselfassembledmonolayersmodifiedabssubstrate
AT wangjiaolong comparativestudyofelectrolesscopperfilmondifferentselfassembledmonolayersmodifiedabssubstrate
AT jiamengke comparativestudyofelectrolesscopperfilmondifferentselfassembledmonolayersmodifiedabssubstrate
AT xiongxuanrui comparativestudyofelectrolesscopperfilmondifferentselfassembledmonolayersmodifiedabssubstrate
AT wangfang comparativestudyofelectrolesscopperfilmondifferentselfassembledmonolayersmodifiedabssubstrate