Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data

Because solder joint interconnections are the weaknesses of microelectronic packaging, their reliability has great influence on the reliability of the entire packaging structure. Based on an accelerated life test the reliability assessment and life prediction of lead-free solder joints using Weibull...

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Detalles Bibliográficos
Autores principales: Mi, Jinhua, Li, Yan-Feng, Yang, Yuan-Jian, Peng, Weiwen, Huang, Hong-Zhong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Hindawi Publishing Corporation 2014
Materias:
Research Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4121147/
https://www.ncbi.nlm.nih.gov/pubmed/25121138
http://dx.doi.org/10.1155/2014/807693

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4121147/
https://www.ncbi.nlm.nih.gov/pubmed/25121138
http://dx.doi.org/10.1155/2014/807693

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