Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis

An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises s...

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Detalles Bibliográficos
Autores principales: Abdul Aziz, M. S., Abdullah, M. Z., Khor, C. Y.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Hindawi Publishing Corporation 2014
Materias:
Research Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4147262/
https://www.ncbi.nlm.nih.gov/pubmed/25225638
http://dx.doi.org/10.1155/2014/482363

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4147262/
https://www.ncbi.nlm.nih.gov/pubmed/25225638
http://dx.doi.org/10.1155/2014/482363

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