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Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis
An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises s...
| Egile Nagusiak: | , , |
|---|---|
| Formatua: | Online Artikulua Texto |
| Hizkuntza: | English |
| Argitaratua: |
Hindawi Publishing Corporation
2014
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| Gaiak: | |
| Sarrera elektronikoa: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4147262/ https://www.ncbi.nlm.nih.gov/pubmed/25225638 http://dx.doi.org/10.1155/2014/482363 |