ロード中…
Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis
An efficient simulation technique was proposed to examine the thermal-fluid structure interaction in the effects of solder temperature on pin through-hole during wave soldering. This study investigated the capillary flow behavior as well as the displacement, temperature distribution, and von Mises s...
| 主要な著者: | , , |
|---|---|
| フォーマット: | Online 論文 テキスト |
| 言語: | English |
| 出版事項: |
Hindawi Publishing Corporation
2014
|
| 主題: | |
| オンライン･アクセス: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4147262/ https://www.ncbi.nlm.nih.gov/pubmed/25225638 http://dx.doi.org/10.1155/2014/482363 |