Improved electro-mechanical performance of gold films on polyimide without adhesion layers

Thin metal films on polymer substrates are of interest for flexible electronic applications and often utilize a thin interlayer to improve adhesion of metal films on flexible substrates. This work investigates the effect of a 10 nm Cr interlayer on the electro-mechanical properties of 50 nm Au films...

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Detalles Bibliográficos
Autores principales: Putz, Barbara, Schoeppner, Rachel L., Glushko, Oleksandr, Bahr, David F., Cordill, Megan J.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Pergamon 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4394137/
https://www.ncbi.nlm.nih.gov/pubmed/26041969
http://dx.doi.org/10.1016/j.scriptamat.2015.02.005
Descripción
Sumario:Thin metal films on polymer substrates are of interest for flexible electronic applications and often utilize a thin interlayer to improve adhesion of metal films on flexible substrates. This work investigates the effect of a 10 nm Cr interlayer on the electro-mechanical properties of 50 nm Au films on polyimide substrates. Ex situ and in situ fragmentation experiments reveal the Cr interlayer causes brittle electro-mechanical behaviour, and thin Au films without an interlayer can support strains up to 15% without significantly degrading electrical conductivity.

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