Improved electro-mechanical performance of gold films on polyimide without adhesion layers

Thin metal films on polymer substrates are of interest for flexible electronic applications and often utilize a thin interlayer to improve adhesion of metal films on flexible substrates. This work investigates the effect of a 10 nm Cr interlayer on the electro-mechanical properties of 50 nm Au films...

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Autores principales: Putz, Barbara, Schoeppner, Rachel L., Glushko, Oleksandr, Bahr, David F., Cordill, Megan J.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Pergamon 2015
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4394137/
https://www.ncbi.nlm.nih.gov/pubmed/26041969
http://dx.doi.org/10.1016/j.scriptamat.2015.02.005
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author Putz, Barbara
Schoeppner, Rachel L.
Glushko, Oleksandr
Bahr, David F.
Cordill, Megan J.
author_facet Putz, Barbara
Schoeppner, Rachel L.
Glushko, Oleksandr
Bahr, David F.
Cordill, Megan J.
author_sort Putz, Barbara
collection PubMed
description Thin metal films on polymer substrates are of interest for flexible electronic applications and often utilize a thin interlayer to improve adhesion of metal films on flexible substrates. This work investigates the effect of a 10 nm Cr interlayer on the electro-mechanical properties of 50 nm Au films on polyimide substrates. Ex situ and in situ fragmentation experiments reveal the Cr interlayer causes brittle electro-mechanical behaviour, and thin Au films without an interlayer can support strains up to 15% without significantly degrading electrical conductivity.
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spelling pubmed-43941372015-06-01 Improved electro-mechanical performance of gold films on polyimide without adhesion layers Putz, Barbara Schoeppner, Rachel L. Glushko, Oleksandr Bahr, David F. Cordill, Megan J. Scr Mater Article Thin metal films on polymer substrates are of interest for flexible electronic applications and often utilize a thin interlayer to improve adhesion of metal films on flexible substrates. This work investigates the effect of a 10 nm Cr interlayer on the electro-mechanical properties of 50 nm Au films on polyimide substrates. Ex situ and in situ fragmentation experiments reveal the Cr interlayer causes brittle electro-mechanical behaviour, and thin Au films without an interlayer can support strains up to 15% without significantly degrading electrical conductivity. Pergamon 2015-06 /pmc/articles/PMC4394137/ /pubmed/26041969 http://dx.doi.org/10.1016/j.scriptamat.2015.02.005 Text en © 2015 Acta Materialia Inc. Elsevier Ltd. All rights reserved. http://creativecommons.org/licenses/by/4.0/ This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Putz, Barbara
Schoeppner, Rachel L.
Glushko, Oleksandr
Bahr, David F.
Cordill, Megan J.
Improved electro-mechanical performance of gold films on polyimide without adhesion layers
title Improved electro-mechanical performance of gold films on polyimide without adhesion layers
title_full Improved electro-mechanical performance of gold films on polyimide without adhesion layers
title_fullStr Improved electro-mechanical performance of gold films on polyimide without adhesion layers
title_full_unstemmed Improved electro-mechanical performance of gold films on polyimide without adhesion layers
title_short Improved electro-mechanical performance of gold films on polyimide without adhesion layers
title_sort improved electro-mechanical performance of gold films on polyimide without adhesion layers
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC4394137/
https://www.ncbi.nlm.nih.gov/pubmed/26041969
http://dx.doi.org/10.1016/j.scriptamat.2015.02.005
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